LM3281

SNVSA38 – NOVEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN pin to GND pin voltage

–0.2

6

V

EN, FB, MODE, SW pins to GND pin

–0.2

VIN + 0.2 or 6

voltage

(whichever is smaller)

Junction temperature (TJ)

150

°C

Continuous power dissipation(3)

Internally limited

Maximum lead temperature (soldering)

260

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. It engages at TJ = 150°C (typ.) and disengages at TJ =

125°C (typ.).

6.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

–1000

1000

pins(1)

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

–250

250

JESD22-C101, all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN

Input voltage (with respect to GND pin)

3

5.5

V

ILOAD

(1)

Output current

0

1200

mA

ILOAD_BURST

(1)

Output current, short bursts (< 100 µS burst at < 10% duty cycle)

0

1400

EN

EN pin voltage (with respect to GND pin)

0

VIN

V

MODE

Mode select pin voltage (with respect to GND pin)

0

VIN

TJ

Junction temperature

–30

125

TA

Ambient temperature

–30

90

°C

TB

PC board temperature

–30

105

(1)

Refer to section High Maximum Current in this data sheet for load current use case profile.

4

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