1

2

3

4

5

CS

GND

SI/O

SC

VDD

LM95071/

LM95071-Q1

3

LM95071-Q1

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SNIS207 – DECEMBER 2018

Product Folder Links: LM95071-Q1

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5 Pin Configuration and Functions

DBV Package

5-Pin SOT-23

Top View

Pin Function

PIN

DESCRIPTION

NO.

NAME

1

CS

Chip Select input. This pin receives an active-low signal from the controller to select the device.

2

GND

Ground. This is the power and signal ground return.

3

SI/O

Serial Input/Output. This serial, bidirectional, data bus pin transmits and receives signals to and from the

controller. Schmitt trigger input in the input mode.

4

SC

Serial bus clock. This serial clock signal comes from the controller. Schmitt trigger input.

5

VDD

Positive Supply Voltage. Supply a DC voltage from 2.4V to 5.5V to this pin and bypass with a 0.1-µF

ceramic capacitor to ground.

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its rated operating conditions.

(2)

Soldering process must comply with Reflow Temperature Profile specifications.

Refer to http://www.ti.com/packaging.

(3)

Reflow temperature profiles are different for lead-free and non-lead-free packages.

(4)

When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD) the current at that pin should be limited to

5 mA.

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2) (3)

MIN

MAX

UNIT

Supply voltage

−0.3

6

V

Voltage at any pin

−0.3

VDD + 0.3

V

Input current at any pin (4)

5

mA

Storage temperature, Tstg

−65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

HBM ESD Classification Level 2

±2000

V

Charged-device model (CDM), per AEC Q100-011

CDM ESD Classification Level C2

±200