2

LM5575-Q1

SNOSB23F – OCTOBER 2008 – REVISED JULY 2019

www.ti.com

Product Folder Links: LM5575-Q1

Submit Documentation Feedback

Copyright © 2008–2019, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings ............................................................ 4

6.3

Recommended Operating Conditions ....................... 4

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 5

6.6

Typical Characteristics .............................................. 7

7

Detailed Description .............................................. 9

7.1

Overview ................................................................... 9

7.2

Functional Block Diagram ......................................... 9

7.3

Feature Description................................................... 9

7.4

Device Functional Modes........................................ 10

8

Application and Implementation ........................ 16

8.1

Application Information............................................ 16

8.2

Typical Application ................................................. 17

9

Power Supply Recommendations ...................... 23

10

Layout................................................................... 23

10.1

Layout Guidelines ................................................. 23

10.2

Layout Examples................................................... 24

10.3

Thermal Considerations ........................................ 25

11

Device and Documentation Support ................. 25

11.1

Device Support .................................................... 25

11.2

Receiving Notification of Documentation Updates 25

11.3

Community Resources.......................................... 25

11.4

Trademarks ........................................................... 25

11.5

Electrostatic Discharge Caution ............................ 26

11.6

Glossary ................................................................ 26

12

Mechanical, Packaging, and Orderable

Information ........................................................... 26

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (February 2019) to Revision F

Page

•

Added Grade 0 information to Features ................................................................................................................................ 1

•

Added Grade 1 and Grade 0 sentence to end of Description ............................................................................................... 1

Changes from Revision D (March 2018) to Revision E

Page

•

Removed references to the LM2xxx devices from the data sheet ........................................................................................ 1

•

Changed "760" mΩ to "800 mΩ" in buck switch Rds(on) over full operating junction temperature row ................................ 6

•

Changed forced off-time maximum value from: 590 ns to: 626 ns in full operating junction temperature range................... 6

Changes from Revision C (December 2014) to Revision D

Page

•

Added links for WEBENCH; minor editorial updates for SEO improvement .......................................................................... 1

•

Changed RθJA from "50°C/W" to "38.4°C/W" ......................................................................................................................... 5

•

Changed RθJC(top) from "14°C/W" to "21.8°C/W"; add additional thermal values ................................................................... 5

•

Corrected unit for RL to "kΩ" .................................................................................................................................................. 8

Changes from Revision B (April 2013) to Revision C

Page

•

Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device

Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ................................................................................................................................................................................... 1

Changes from Revision A (April 2013) to Revision B

Page

•

Changed layout of National Semiconductor data sheet to TI format.................................................................................... 25