www.power.com

June 2015

LinkSwitch-HP Family

Energy Efficient, High-Power Off-Line Switcher

with Accurate Primary-Side Regulation (PSR)

This Product is Covered by Patents and/or Pending Patent Applications.

Product Highlights

EcoSmart™- Energy Efficient

•

Multi-mode control maximizes efficiency over full load range

•

No-load consumption below 30 mW at 230 VAC (LNK67xx)

•

>75% efficiency with 1 W input at 230 VAC

•

>50% efficiency with 0.1 W input at 230 VAC

High Design Flexibility for Low System Cost

•

Dramatically simplifies power supply designs

•

Eliminates optocoupler and all secondary control circuitry

•

±5% or better output voltage tolerance

•

132 kHz operation reduces transformer and power supply size

•

Accurate programmable current limit

•

Compensation over line limits overload power

•

Frequency jittering reduces EMI filter cost

•

Fully integrated soft-start for minimum start-up stress

•

725 V MOSFET simplifies meeting derating requirements

(LNK677x)

•

650 V MOSFET for lowest system cost (LNK676x/LNK666x)

•

Fast transient response family option (LNK666x)

Extensive Protection Features

•

Auto-restart limits power delivery to 3% during overload faults

•

Output short-circuit protection (SCP)

•

Output overload/over-current protection (OPP, OCP)

•

Optional extended shutdown delay time

•

Output overvoltage protection (OVP), auto-restart or latching

•

Line brown-in/out protection (line UV)

•

Line overvoltage (OV) shutdown extends line surge withstand

•

Accurate thermal shutdown (OTP), hysteretic or latching

Advanced Green Package Options

•

eSIP™-7C package:

•

Vertical orientation for minimum PCB footprint

•

Simple heat sink mounting using clip or adhesive pad

•

eSOP™-12B package:

•

Low profile surface mounted for ultra-slim designs

•

Heat transfer to PCB via exposed pad and SOURCE pins

•

Supports either wave or IR reflow soldering

•

eDIP™-12B package:

•

Low profile through-hole mounted for ultra-slim designs

•

Heat transfer to PCB via exposed pad or optional metal heat sink

•

Extended creepage to DRAIN pin

•

Heat sink is connected to SOURCE for low EMI

•

Halogen free and RoHS compliant

Typical Applications

•

LCD Monitor and TV

•

Adapter

•

Appliances

•

Embedded power supplies (DVD, set-top box)

•

Industrial

Figure 1.

Typical Application Schematic.

CONTROL

Figure 2.

Package Options.

eSOP-12B (K Package)

eDIP-12B (V Package)

eSIP-7C (E Package)

Output Power Table

Product4

Heat Sink

230 VAC ±15%

85-265 VAC

Adapter

Open

Frame

Adapter

Open

Frame

LNK6xx3K/V PCB-W1

15 W

25 W

9 W

15 W

LNK6xx3K

PCB-R2

21 W

35 W

12 W

21 W

LNK6xx3E

Metal

21 W

35 W

13 W

27 W

LNK6xx4K/V PCB-W1

16 W

28 W

11 W

20 W

LNK6xx4K

PCB-R2

22 W

39 W

15 W

28 W

LNK6xx4E

Metal

30 W

47 W

20 W

36 W

LNK6xx5K/V PCB-W1

19 W

30 W

13 W

22 W

LNK6xx5K

PCB-R2

26 W

42 W

18 W

31 W

LNK6xx5E

Metal

40 W

593 W

26 W

45 W

LNK6xx6K/V PCB-W1

21 W

34 W

15 W

26 W

LNK6xx6K

PCB-R2

30 W

48 W

22 W

37 W

LNK6xx6E

Metal

60 W

883 W

40 W

683 W

LNK6xx7K/V PCB-W1

25 W

41 W

19 W

30 W

LNK6xx7K

PCB-R2

36 W

59 W

27 W

43 W

LNK6xx7E

Metal

853 W

1173 W

55 W

903 W

LNK6xx8K/V PCB-W1

29 W

47 W

21 W

34 W

LNK6xx8K

PCB-R2

41 W

68 W

30 W

48 W

LNK6xx8E

Metal

983 W

1353 W

633 W

1043 W

LNK6xx9K/V PCB-W1

33 W

54 W

25 W

39 W

LNK6xx9K

PCB-R2

47 W

77 W

36 W

56 W

LNK6xx9E

Metal

1113 W

1533 W

723 W

1183 W

Table 1. Output Power Table.

Notes:

1. PCB heat sink with wave soldering.

2. PCB heat sink with IR reflow soldering (exposed pad thermally connected to PCB).

3. Maximum power specified based on proper thermal dissipation.

4. Packages: E: eSIP-7C, K: eSOP-12B, V: eDIP-12B. See Table 2 for all device options.

Exposed

Pad

Exposed

Pad