TL1454A, TL1454AY

DUALCHANNEL PULSEWIDTHMODULATION (PWM)

CONTROL CIRCUIT

SLVS423 A− MAY 2002 − REVISED SEPTEMBER 2002

3

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

TL1454AY chip information

This device, when properly assembled, displays characteristics similar to the TL1454AC. Thermal compression

or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

TL1454AY

(2)

(14)

(1)

(3)

(4)

(5)

(6)

(7)

(8)

(16)

(13)

(12)

(11)

(10)

(9)

REF

DTC2

IN2+

IN2 −

COMP2

VCC

OUT2

OUT1

COMP1

IN1−

IN1 +

RT

CT

GND

86

108

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(10)

(11)

(12)

(13)

(14)

(15)

(16)

(8)

(9)

(15)

SCP

DTC1