PIC16F570 datasheet(98/134 Pages) MICROCHIP

98 / 134 page

PIC16F527

DS40001652C-page 98

 2012-2014 Microchip Technology Inc.

TABLE 15-16: THERMAL CONSIDERATIONS

TABLE 15-15: FLASH DATA MEMORY WRITE/ERASE TIME

AC CHARACTERISTICS

Standard Operating Conditions (unless otherwise specified)

Operating Temperature -40

C  TA  +85C (industrial)

-40

C  TA  +125C (extended)

Operating Voltage VDD range is described in

Section 15.1 “DC Characteristics: PIC16F527 (Industrial)”.

Param.

No.

Sym.

Characteristic

Min.

Typ.(1) Max.

Units

Conditions

TDW

Flash Data Memory

Write Cycle Time

23.5

TDE

Flash Data Memory

Erase Cycle Time

23.5

Note 1:

Data in the Typical (“Typ”) column is at 5V, 25°C unless otherwise stated. These parameters are for design

guidance only and are not tested.

Standard Operating Conditions (unless otherwise stated)

VDD = 5.0V

Operating temperature: 25°C

Param.

No.

Sym.

Characteristic

Typ.

Units

Conditions

TH01

JA

Thermal Resistance Junction to Ambient

62.2

C/W

20-pin PDIP package

77.7

C/W

20-pin SOIC package

87.3

C/W

20-pin SSOP package

C/W

20-pin QFN 4x4mm package

32.8

C/W

20-pin UQFN 4x4mm package

C/W

20-pin UQFN 3x3mm package

TH02

JC

Thermal Resistance Junction to Case

27.5

C/W

20-pin PDIP package

23.1

C/W

20-pin SOIC package

31.1

C/W

20-pin SSOP package

5.3

C/W

20-pin QFN 4x4mm package

27.4

C/W

20-pin UQFN 4x4mm package

C/W

20-pin UQFN 3x3mm package

TH03

TJMAX

Maximum Junction Temperature

150

C

TH04

Power Dissipation

—

PD = PINTERNAL + PI/O

TH05

PINTERNAL Internal Power Dissipation

—

PINTERNAL = IDD x VDD(1)

TH06

PI/O

I/O Power Dissipation

—

PI/O =

 (IOL * VOL) +  (IOH * (VDD - VOH))

TH07

PDER

Derated Power

—

PDER = PDMAX (TJ - TA)/

JA(2)

Note 1:

IDD is current to run the chip alone without driving any load on the output pins.

TA = Ambient Temperature. TJ = Junction Temperature.

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