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PIC16F570 Datasheet(PDF) 129 Page - Microchip Technology |
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PIC16F570 Datasheet(HTML) 129 Page - Microchip Technology |
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129 / 134 page  2012-2014 Microchip Technology Inc. DS40001652C-page 129 PIC16F527 RECOMMENDED LAND PATTERN For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 1.85 1.85 MILLIMETERS 0.40 BSC MIN E MAX 3.00 Contact Pad Length (X20) Contact Pad Width (X20) Y1 X1 0.75 0.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-2256A NOM 20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JP) - 3x3x0.5 mm Body [UQFN] SILK SCREEN 1 2 20 C1 Contact Pad Spacing 3.00 Contact Pad to Center Pad (X20) G1 0.20 E C1 C2 Y2 X2 2X 0.35 X1 Y1 G1 |
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