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ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATING TABLE

TPA112

SLOS212E – AUGUST 1998 – REVISED JUNE 2004

These devices have limited built-in ESD protection. The leads should be shorted together or the device

placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

AVAILABLE OPTIONS

PACKAGED DEVICES

MSOP

TA

SMALL OUTLINE(1)

MSOP(1)

SYMBOLIZATION

(D)

(DGN)

–40

°C to 85°C

TPA112D

TPA112DGN

TI AAD

(1)

The D and DGN packages are available in left-ended tape and reel only (e.g., TPA112DR,

TPA112DGNR).

Terminal Functions

TERMINAL

I/O

DESCRIPTION

NAME

NO.

GND

4

I

GND is the ground connection.

IN1-

2

I

IN1- is the inverting input for channel 1.

IN1+

3

I

IN1+ is the noninverting input for channel 1.

IN2-

6

I

IN2- is the inverting input for channel 2.

IN2+

5

I

IN2+ is the noninverting input for channel 2.

VDD

8

I

VDD is the supply voltage terminal.

VO1

1

O

VO1 is the audio output for channel 1.

VO2

7

O

VO2 is the audio output for channel 2.

over operating free-air temperature range (unless otherwise noted)(1)

UNIT

VDD

Supply voltage

6 V

VI

Differential input voltage

–0.3 V to VDD + 0.3 V

II

Input current

±2.5 µA

IO

Output current

±250 mA

Continuous total power dissipation

Internally llimited

TJ

Operating junction temperature range

–40

°C to 150°C

Tstg

Storage temperature range

–65

°C to 150°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

(1)

Stresses beyond those listed under "absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

TA ≤ 25°C

DERATING FACTOR

TA = 70°C

TA = 85°C

PACKAGE

POWER RATING

ABOVE TA = 25°C

POWER RATING

POWER RATING

D

725 mW

5.8 mW/

°C

464 mW

377 mW

DGN

2.14 W(1)

17.1 mW/

°C

1.37 W

1.11 W

(1)

See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report

(SLMA002), for more information on the PowerPAD package. The thermal data was measured on a

PCB layout based on the information in the section entitled Texas Instruments Recommended Board

for PowerPAD, of that document.

2