4.4 Thermal Information

THERMAL METRIC(1)

CDx4AC161

UNIT

E

M

14 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

67

73

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

4.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

TA = 25°C

–55°C to 125°C

–40°C to 85°C

UNIT

MIN

MAX

MIN

MAX

MIN

MAX

VOH

VI =VIH or VIL

IOH = –50 µA

1.5 V

1.4

1.4

1.4

V

3 V

2.9

2.9

2.9

4.5 V

4.4

4.4

4.4

IOH = –4 mA

3 V

2.58

2.4

2.48

IOH = –24 mA

4.5 V

3.94

3.7

3.8

IOH = –50 mA†

5.5 V

–

3.85

–

IOH = –75 mA†

5.5 V

–

–

3.85

VOL

VI = VIH or V IL

IOL = 50 µA

1.5 V

0.1

0.1

0.1

V

3 V

0.1

0.1

0.1

4.5 V

0.1

0.1

0.1

IOL = 12 mA

3 V

0.36

0.5

0.44

IOL = 24 mA

4.5 V

0.36

0.5

0.44

IOL = 50 mA†

5.5 V

1.65

IOL = 75 mA†

5.5 V

1.65

II

VI = V CC or GND

5.5 V

± 0.1

± 1

± 1

µA

ICC

VI = V CC or GND

IO = 0

5.5 V

8

160

80

µA

Ci

10

10

10

pF

4.6 Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted)

VCC

–55°C to 125°C

–40°C to 85°C

UNIT

MIN

MAX

MIN

MAX

fclock

Clock frequency

1.5 V

7

8

MHz

3.3 V ± 0.3 V

64

73

5 V ± 0.5 V

90

103

tw

Pulse duration

CLK high or low

1.5 V

69

61

ns

3.3 V ± 0.3 V

7.7

6.8

5 V ± 0.5 V

5.5

4.8

CLR low

1.5 V

63

55

ns

3.3 V ± 0.3 V

7

6.1

5 V ± 0.5 V

5

4.4

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CD54AC161, CD74AC161

SCHS239D – NOVEMBER 1998 – REVISED MAY 2024

Copyright © 2024 Texas Instruments Incorporated

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