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FPD03784 Datasheet(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # FPD03784
Description  Low Power, Low EMI, TFT-LCD Column Driver with Dual, TTL Bus Inputs, 64 Grayshades, and 384 Outputs for XGA/SXGA Applications
PDF  12 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

FPD03784 Datasheet(HTML) 3 Page - National Semiconductor (TI)

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Analog Electrical Characteristics (Continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
A
IHBIAS
I
SIN to IHBIAS Gain Factor
22.5
R
CSTIME
CSTIME resistance
5
12
k
Ω
C
CSTIME
CSTIME capacitance
100
150
pF
I
SIN
Input Current Source
16
40
100
µA
I
REF
Amplifier Reference Current
10
75
µA
R
DAC
RDAC References (V
GMA1 to
V
GMA6 and VGMA7 to VGMA12)
each
12.0
15.0
18.0
k
Ω
V
pperr
Output Peak to Peak Error (gray
levels 0 through 58)
V
GMA1 =VDD2 − 0.2V
V
GMA12 =VSS2 + 0.2V
(Note 8)
±3
±12
mV
Output Peak to Peak Error (gray
levels 59 through 63)
±5
±25
mV
Note 5: VDD2 = 9.5V, VHBIAS = 9.5V, RIREF = 220 kΩ,RISIN = 470 kΩ,VDD1 = 3.3V, DCLK = 65 MHz, RLOAD =5 kΩ,CLOAD = 50 pF, charge share time = 1.5
µs, all other swinging between VGMA1 (= 8.0V) and VGMA12 (= 0.5V) with a line time = 22 µs.
Note 6: The following relationship must be maintained between the reference voltages: VDD2 >VGMA1 >VGMA2 >VGMA3 >VGMA4 >VGMA5 >VGMA6 >VGMA7
>V
GMA8 >VGMA9 >VGMA10 >VGMA11 >VGMA12 >VSS2
Note 7: IMAX is the current delivered into a potential of 0.2V when the output is commanded to a potential of VDD2 − 0.2V or the current into the output from a
potential of VDD2 − 0.2V when the output is commanded to 0.2V (VSS2 = 0V).
Note 8: This parameter reflects the error in peak-to-peak output voltage for each gray-level when the output swings from the gray-level high value, VHxx, to its low
value, VLxx. This parameter applies to every output on the die. The Typical value represents one standard deviation from ideal based on tester data. The Maximum
value is a constraint of the test environment, not the performance of the part.
Note 9: Current into device pins is defined as positive. Current out of device pins is defined as negative.
AC Electrical Characteristics
Digital AC Characteristics (3.3V Logic)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
CLK
Data Clock Frequency
SINGLE = 1 (Note 10)
65.0
MHz
SINGLE = 0 (Note 10)
27.5
MHz
t
WDCP
CLK Clock Pulse Width
SINGLE = 1 (Note 10)
5
ns
SINGLE = 0 (Note 10)
10
ns
t
DSU
Data Setup DX[5:0], POL,
INVTxxx
4ns
t
DHLD
Data Hold DX[5:0], POL, INVTxxx
4
ns
t
TWP
LOAD Pulse Width
50
ns
t
LDENSU
LOAD to First ENIO Setup
(Note 11)
200
ns
t
ENDCSU
ENIOx Input to CLK Setup
2.5
ns
t
WEN
ENIOx Input Pulse Width
10
ns
t
ENPR
ENIOx Output Prop Delay
Load = 20pF
12
ns
t
LDLY
Delay to LOAD Pulse
3
CLKs
Digital AC Characteristics (2.5V Logic)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
CLK
Data Clock Frequency
SINGLE = 1 (Note 10)
40.0
MHz
SINGLE = 0 (Note 10)
17.5
MHz
t
WDCP
CLK Clock Pulse Width
SINGLE = 1 (Note 10)
10
ns
SINGLE = 0(Note 10)
25
ns
t
DSU
Data Setup DX[5:0], POL,
INVTxxx
4ns
t
DHLD
Data Hold DX[5:0], POL, INVTxxx
6
ns
t
TWP
LOAD Pulse Width
50
ns
t
LDENSU
LOAD to First ENIO Setup
(Note 11)
200
ns
t
ENDCSU
ENIOx Input to CLK Setup
4
ns
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