5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

VCC

Supply voltage(2)

7

V

VI

Input voltage range

5.5

V

Continuous total power dissipation

See Dissipation Ratings

TJ

Operating free-air temperature range

0

70

°C

Tstg

Storage temperature range

–65

150

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 s

260

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential input voltage, are with respect to the network ground terminal.

(3)

Differential input voltage is measured at the noninverting input with respect to the corresponding inverting input.

5.2 Dissipation Ratings

PACKAGE

TA ≤ 25°C

POWER RATING

OPERATING FACTOR

ABOVE TA = 25°C

TA ≤ 70°C

POWER RATING

D

725 mW

5.8 mW/°C

464 mW

P

1000 mW

8.0 mW/°C

640 mW

PS

450 mW

3.6 mW/°C

288 mW

5.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VCC

Supply voltage

4.75

5

5.25

V

VIH

High-level input voltage

2

V

VIL

Low-level input voltage

0.8

V

IOH

High-level output current

–40

mA

IOL

Low-level output current

40

mA

TA

Operating free-air temperature

0

70

°C

5.4 Thermal Information

THERMAL METRIC(1)

D

P

PS

UNIT

8-Pins

R θJA

Junction-to-ambient thermal resistance

116.7

84.3

89.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

56.3

65.4

46.2

°C/W

R θJB

Junction-to-board thermal resistance

63.4

62.1

50.7

°C/W

ψ JT

Junction-to-top characterization parameter

8.8

31.3

23.5

°C/W

ψ JB

Junction-to-board characterization parameter

62.6

60.4

60.3

°C/W

R θJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

SN75158

SLLS085C – JANUARY 1977 – REVISED MARCH 2024

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