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TLV760 Datasheet(PDF) 4 Page - Texas Instruments

Part # TLV760
Description  TLV760 100-mA, 30-V, Fixed-Output, Linear-Voltage Regulator
PDF  24 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TLV760 Datasheet(HTML) 4 Page - Texas Instruments

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TLV760
SNVSAV1A – JUNE 2017 – REVISED OCTOBER 2017
www.ti.com
Product Folder Links: TLV760
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings(1) may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
See Recommended Operating Conditions section for more details.
6 Specifications
6.1 Absolute Maximum Ratings
(1)
MIN
MAX
UNIT
Input voltage (IN to GND)
–0.3
35
V
Output Voltage (OUT)
VIN + 0.3
V
Output Current
Internally limited(2)
mA
Junction temperature
–40
150
°C
Storage temperature, Tstg
−65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Maximum input voltage (IN to GND)
30
V
Output current (IOUT)
100
mA
Input and output capacitor (COUT)
0.1
µF
Junction temperature, TJ
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
TLV760
UNIT
DBZ (SOT-23)
3 PINS
RθJA
Junction-to-ambient thermal resistance
275.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
92.8
°C/W
RθJB
Junction-to-board thermal resistance
56.8
°C/W
ψJT
Junction-to-top characterization parameter
2.9
°C/W
ψJB
Junction-to-board characterization parameter
55.6
°C/W



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