6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

MAX

UNIT

Supply voltage

VDD

–0.3

6

V

Voltage at

OUTA, OUTB

-0.3

6

V

Voltage at

SETA, SETB

–0.3

VDD + 0.3

V

Junction temperature, TJ

–55

150

°C

Storage temperature, Tstg

–60

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Powering the device when the operating junction temperature is outside the Recommended Operating Conditions, may affect the

functional operation of the device. The device must be power cycled after the system has returned to conditions as indicated under

Recommended Operating Conditions.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VDD

Supply voltage

1.62

3.3

5.5

V

VOUTA

Channel A output pull-up voltage (open-drain)

VDD + 0.3

V

VOUTB

Channel B output pull-up voltage (open-drain)

VDD + 0.3

V

ISETA

SETA pin circuit leakage current

-20

20

nA

ISETB

SETB pin circuit leakage current

-20

20

nA

RPA

Pullup resistor connected from OUTA to VDDIO(1)

1

10

kΩ

RPB

Pullup resistor connected from OUTB to VDDIO(1)

TA

Operating free-air temperature (specified performance)

–55

130

°C

(1)

Where VDDIO is an independent power supply other than VDD, and shall not exceed (VDD + 0.3) V.

6.4 Thermal Information

THERMAL METRIC(1)

TMP390

UNIT

DRL (SOT)

6 PINS

RθJA

Junction-to-ambient thermal resistance

230

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

103.4

°C/W

RθJB

Junction-to-board thermal resistance

111.6

°C/W

ψJT

Junction-to-top characterization parameter

5.3

°C/W

ψJB

Junction-to-board characterization parameter

110.5

°C/W

MT

Thermal Mass

1.83

mJ/°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor IC Package Thermal Metrics application

report, (SPRA953).

TMP390

SBOS904A – MAY 2019 – REVISED AUGUST 2020

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