www.ti.com

ABSOLUTE MAXIMUM RATINGS

ADS8411

SLAS369B – APRIL 2002 – REVISED DECEMBER 2004

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated

circuits be handled with appropriate precautions. Failure to observe proper handling and installation

procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

MAXIMUM

MAXIMUM

NO MISSING

PACKAGE

TEMPERA-

TRANSPORT

INTEGRAL

DIFFERENTIAL

CODES

PACKAGE

ORDERING

MODEL

DESIG-

TURE

MEDIA

LINEARITY

LINEARITY

RESOLUTION

TYPE

INFORMATION

NATOR

RANGE

QUANTITY

(LSB)

(LSB)

(BIT)

Tape and reel

ADS8411IPFBT

250

48 Pin

ADS8411I

–6 ~ 6

–2~3

15

PFB

–40

°C to 85°C

TQFP

Tape and reel

ADS8411IPFBR

1000

Tape and reel

ADS8411IBPFBT

250

48 Pin

ADS8411IB

–2.5 ~ 2.5

–1~2

16

PFB

–40

°C to 85°C

TQFP

Tape and reel

ADS8411IBPFBR

1000

(1)

For the most current specifications and package information, refer to our website at www.ti.com.

over operating free-air temperature range unless otherwise noted(1)

UNIT

+IN to AGND

–0.4 V to +VA + 0.1 V

Voltage

–IN to AGND

–0.4 V to 0.5 V

+VA to AGND

–0.3 V to 7 V

Voltage range

+VBD to BDGND

–0.3 V to 7 V

+VA to +VBD

–0.3 V to 2.55 V

Digital input voltage to BDGND

–0.3 V to +VBD + 0.3 V

Digital output voltage to BDGND

–0.3 V to +VBD + 0.3 V

TA

Operating free-air temperature range

–40

°C to 85°C

Tstg

Storage temperature range

–65

°C to 150°C

Junction temperature (TJ max)

150

°C

Power dissipation

(TJMax - TA)/θJA

TQFP package

θ

JA thermal impedance

86

°C/W

Vapor phase (60 sec)

215

°C

Lead temperature, soldering

Infrared (15 sec)

220

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

2