TPS65149 datasheet(2/50 Pages) TI2

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TI Information — Selective Disclosure

TPS65149

SLVSAC1 – SEPTEMBER 2010

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION(1)

ORDERING

PACKAGE

PACKAGE MARKING

–40°C to 85°C

TPS65149RSHR

56-Pin 7×7 QFN

TPS65149

(1)

The device is supplied taped and reeled, with 3000 devices per reel.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

FBN, VL, WP, SCL, SDA, FBP, RESETIN, CLKIN1, CLKIN2, CLKIN3, CLKIN4, CLKIN5,

CLKIN6, FBPH, FREQ, COMP, RHVS, FB, SS, GD, VIN, DRVN, VDET, STVIN, RNTC,

RSET, EN, XAO

DVRO, AVDD, SW, HVS

Pin Voltage(2)

DRVP, VGH

VGL1, VGL2

–20

DSCHG1, DSCHRG2, STVOUT, RESETOUT, CLKOUT1, CLKOUT2, CLKOUT3,

–20 to 40

CLKOUT4, CLKOUT5, CLKOUT6

Human Body Model

ESD Rating

Machine Model

200

Charged Device Model

500

Continuous Power Dissipation

See Thermal Table

Ambient temperature

–40 to 85

°C

Junction temperature

–40 to 150

°C

TSTG

Storage temperature

–65 to 150

°C

Lead temperature (soldering, 10 seconds)

300

°C

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

With respect to the AGND and LGND pins.

THERMAL INFORMATION

TPS65149

THERMAL METRIC(1)

QFN

UNITS

56 PINS

qJA

Junction-to-ambient thermal resistance

27.4

qJC(top)

Junction-to-case(top) thermal resistance

20.4

qJB

Junction-to-board thermal resistance

7.1

°C/W

yJT

Junction-to-top characterization parameter

0.5

yJB

Junction-to-board characterization parameter

7.0

qJC(bottom)

Junction-to-case(bottom) thermal resistance

2.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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