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LSF0108 Datasheet(PDF) 216 Page - Nexperia B.V. All rights reserved |
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LSF0108 Datasheet(HTML) 216 Page - Nexperia B.V. All rights reserved |
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216 / 234 page  Nexperia selection guide 2020 216 Minimized outline drawings and reflow soldering footprint Dimensions in mm Images are for reference only, for detailed drawings please visit nexperia.com/packages 48-pin SMD packages TSSOP48 (SOT362-1) TSSOP48 (SOT362-1) SOT362-1 Footprint information for reflow soldering of TSSOP48 package sot362-1_fr Issue date 13-07-02 18-10-09 recommended stencil thickness: 0.1 mm occupied area solder paste solder resist solder land 0.4 0.28 0.22 0.125 0.56 12.12 12.27 14.1 0.125 6.1 8.9 7.0 9.15 0.5 1.5 1.4 SOT362-1 Footprint information for reflow soldering of TSSOP48 package sot362-1_fr Issue date 13-07-02 18-10-09 recommended stencil thickness: 0.1 mm occupied area solder paste solder resist solder land 0.4 0.28 0.22 0.125 0.56 12.12 12.27 14.1 0.125 6.1 8.9 7.0 9.15 0.5 1.5 1.4 13-08-05 Dimensions in mm 1.2 8.1 6.1 24 1 25 48 12.5 TVSOP48 (SOT480-1) TVSOP48 (SOT480-1) 03-02-18 Dimensions in mm 25 48 9.7 24 1 1.1 max 6.4 4.4 SOT480-1 Footprint information for reflow soldering of TSSOP48 package sot480-1_fr Issue date 18-10-09 18-10-11 recommended stencil thickness: 0.1 mm occupied area solder paste solder resist solder land 0.3 0.24 0.16 0.125 0.43 9.66 9.81 11.8 0.125 4.5 7.2 5.3 7.45 0.4 1.45 1.35 SOT480-1 Footprint information for reflow soldering of TSSOP48 package sot480-1_fr Issue date 18-10-09 18-10-11 recommended stencil thickness: 0.1 mm occupied area solder paste solder resist solder land 0.3 0.24 0.16 0.125 0.43 9.66 9.81 11.8 0.125 4.5 7.2 5.3 7.45 0.4 1.45 1.35 32-pin SMD packages HVQFN32 (SOT617-3) HVQFN32 (SOT617-3) Nexperia SOT617-3 plastic, leadless thermal enhanced very thin quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body 3. Soldering SOT617-3 Footprint information for reflow soldering of HVQFN32 package occupied area solder paste solder land Dimensions in mm P 0.5 sot617-3_fr Issue date 11-11-15 11-11-20 Ax Ay Bx C D 5.95 5.95 4.25 0.85 By 4.25 0.27 Gx 5.25 Gy 5.25 Hy 6.2 Hx 6.2 SLx SLy nSPx nSPy 3.75 3.75 3 3 0.30 0.60 detail X C SLy D SLx Bx Ay P nSPy nSPx see detail X Gx Hx Gy Hy By Ax Fig. 2. Reflow soldering footprint for HVQFN32 (SOT617-3) SOT617-3 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 3 June 2018 3 / 5 Nexperia SOT617-3 plastic, leadless thermal enhanced very thin quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body 3. Soldering SOT617-3 Footprint information for reflow soldering of HVQFN32 package occupied area solder paste solder land Dimensions in mm P 0.5 sot617-3_fr Issue date 11-11-15 11-11-20 Ax Ay Bx C D 5.95 5.95 4.25 0.85 By 4.25 0.27 Gx 5.25 Gy 5.25 Hy 6.2 Hx 6.2 SLx SLy nSPx nSPy 3.75 3.75 3 3 0.30 0.60 detail X C SLy D SLx Bx Ay P nSPy nSPx see detail X Gx Hx Gy Hy By Ax Fig. 2. Reflow soldering footprint for HVQFN32 (SOT617-3) SOT617-3 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 3 June 2018 3 / 5 Nexperia SOT617-3 plastic, leadless thermal enhanced very thin quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body 3. Soldering SOT617-3 Footprint information for reflow soldering of HVQFN32 package occupied area solder paste solder land Dimensions in mm P 0.5 sot617-3_fr Issue date 11-11-15 11-11-20 Ax Ay Bx C D 5.95 5.95 4.25 0.85 By 4.25 0.27 Gx 5.25 Gy 5.25 Hy 6.2 Hx 6.2 SLx SLy nSPx nSPy 3.75 3.75 3 3 0.30 0.60 detail X C SLy D SLx Bx Ay P nSPy nSPx see detail X Gx Hx Gy Hy By Ax Fig. 2. Reflow soldering footprint for HVQFN32 (SOT617-3) SOT617-3 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 3 June 2018 3 / 5 Nexperia SOT617-3 plastic, leadless thermal enhanced very thin quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body 2. Package outline References Outline version European projection Issue date IEC JEDEC JEITA SOT617-3 MO-220 sot617-3_po 11-06-14 11-06-21 Unit(1) mm max nom min 0.85 0.05 0.00 0.2 5.1 4.9 3.75 3.45 5.1 4.9 3.75 3.45 0.5 3.5 A1 Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm SOT617-3 b c 0.30 0.18 D(1) A(1) Dh E(1) Eh e e1 e2 L 3.5 v w 0.1 0.1 y 0.05 0.5 0.3 y1 0.05 0 2.5 5 mm scale 1/2 e A C B v C w terminal 1 index area A A1 detail X y y1 C e L Eh Dh e e1 b 9 16 32 25 24 17 8 1 X D E C B A e2 terminal 1 index area 1/2 e Fig. 1. Package outline HVQFN32 (SOT617-3) SOT617-3 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Package information 3 June 2018 2 / 5 24-pin SMD packages TSSOP24 (SOT355-1) TSSOP24 (SOT355-1) SOT355-1 Footprint information for reflow soldering of TSSOP24 package sot355-1_fr Issue date 17-11-28 17-11-30 occupied area solder paste deposit solder land solder land plus solder paste recommended stencil thickness: 0.125 mm 0.3 0.5 0.60 1.35 5.30 7.45 0.65 0.75 0.40 0.125 8.20 8.60 0.125 4.50 1.25 7.20 SOT355-1 Footprint information for reflow soldering of TSSOP24 package sot355-1_fr Issue date 17-11-28 17-11-30 occupied area solder paste deposit solder land solder land plus solder paste recommended stencil thickness: 0.125 mm 0.3 0.5 0.60 1.35 5.30 7.45 0.65 0.75 0.40 0.125 8.20 8.60 0.125 4.50 1.25 7.20 |
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