6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted). Voltage level refers to the AGNDx ground of the device.

(1)

POS

MIN

MAX

UNIT

M1.1

Voltage on supply input pin

VCCA

–0.3

6

V

M1.2

Voltage on all buck supply voltage input

pins

PVIN_Bx

–0.3

6

V

M1.3

Voltage difference between supply input

pins

Between VCCA and each PVIN_Bx

–0.5

0.5

V

M1.4a

Voltage on all buck switch nodes

SW_Bx pins

-0.3

VPVIN_Bx + 0.3 V,

up to 6 V

V

M1.4b

Voltage on all buck switch nodes

SW_Bx pins, 10-ns transient

–2

10

V

M1.5

Voltage on all buck voltage sense nodes

FB_Bx

–0.3

4

V

M1.6

Voltage on all buck power ground pins

PGND

–0.3

0.3

V

M1.7

Voltage on internal LDO output pin

VOUT_LDO

–0.3

2

V

M1.8

Voltage on I/O supply pin

VIO

–0.3

The lower of

two: VCCA or

6V

V

M1.9

Voltage on logic pins (input or output)

I2C and SPI pins, nINT pin, and all GPIO pins

–0.3

6

V

M1.13a

Voltage rise slew-rate on input supply pins

VCCA, PVIN_Bx (voltage below 2.7 V)

60

mV/µs

M1.13b

VIO (only when VCCA < 2 V)

60

M1.10a

Peak output current

All pins other than power resources

20

mA

M1.10b

Buck regulators: PVIN_Bx, SW_Bx, and PGNDx per

phase

5

A

M1.10c

Average output current, 100 k hour, TJ =

125

℃

GPIOx pins, source current

3

mA

M1.10d

GPIO1/3/5/8/9/10, SDA_I2C1/SDI_SPI and nINT

pins, sink current

8

M1.10e

GPIO2/4/6/7 pins, sink current

3

M1.10f

Buck regulators

3.5

A

M1.11

Junction temperature, TJ

–45

160

°C

M1.12

Storage temperature, Tstg

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum

Ratings do not imply functional operation of the device at these or any other conditions beyond those listed

under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within

the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability,

functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

POS

VALUE

UNIT

M1.13

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per AEC Q100-002(1)

±2000

V

M1.14

V(ESD)

Electrostatic

discharge

Charged-device model (CDM), per AEC Q100-011

±500

V

(1)

AEC Q100-002 indicates that HBM stressing is in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

www.ti.com

LP8762-Q1

SNVSCV7 – OCTOBER 2024

Copyright © 2024 Texas Instruments Incorporated

Submit Document Feedback

9

Product Folder Links: LP8762-Q1