SN74LVC16245A

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SCES062Q – DECEMBER 1995 – REVISED JUNE 2014

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Operating

1.65

3.6

VCC

Supply voltage

V

Data retention only

1.5

VCC = 1.65 V to 1.95 V

0.65 × VCC

VIH

High-level input voltage

VCC = 2.3 V to 2.7 V

1.7

V

VCC = 2.7 V to 3.6 V

2

VCC = 1.65 V to 1.95 V

0.35 × VCC

VIL

Low-level input voltage

VCC = 2.3 V to 2.7 V

0.7

V

VCC = 2.7 V to 3.6 V

0.8

VI

Input voltage

0

5.5

V

High or low state

0

VCC

VO

Output voltage

V

3-state

0

5.5

VCC = 1.65 V

–4

VCC = 2.3 V

–8

IOH

High-level output current

mA

VCC = 2.7 V

–12

VCC = 3 V

–24

VCC = 1.65 V

4

VCC = 2.3 V

8

IOL

Low-level output current

mA

VCC = 2.7 V

12

VCC = 3 V

24

Δt/Δv

Input transition rise or fall rate

5

ns/V

TA

Operating free-air temperature

–40

125

°C

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

7.4 Thermal Information

DGG

DGV

DL

THERMAL METRIC(1)

UNIT

48 PINS

48 PINS

48 PINS

RθJA

Junction-to-ambient thermal resistance

67.1

80.2

70.6

RθJC(top)

Junction-to-case (top) thermal resistance

19.9

32.7

36.8

RθJB

Junction-to-board thermal resistance

34.2

43.5

43.1

°C/W

ψJT

Junction-to-top characterization parameter

1.8

4.7

13.9

ψJB

Junction-to-board characterization parameter

33.9

42.9

42.6

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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