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DRV8835

SLVSB18H – MARCH 2012 – REVISED AUGUST 2016

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Copyright © 2012–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 4

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ...................................... 5

6.2

ESD Ratings.............................................................. 5

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 6

6.6

Timing Requirements ................................................ 7

6.7

Typical Characteristics .............................................. 8

7

Detailed Description .............................................. 9

7.1

Overview ................................................................... 9

7.2

Functional Block Diagram ......................................... 9

7.3

Feature Description................................................. 10

7.4

Device Functional Modes........................................ 10

8

Application and Implementation ........................ 12

8.1

Application Information............................................ 12

8.2

Typical Application ................................................. 12

9

Power Supply Recommendations ...................... 14

9.1

Bulk Capacitance .................................................... 14

9.2

Power Supplies and Input Pins ............................... 14

10

Layout................................................................... 15

10.1

Layout Guidelines ................................................. 15

10.2

Layout Example .................................................... 15

10.3

Thermal Considerations ........................................ 15

11

Device and Documentation Support ................. 17

11.1

Documentation Support ........................................ 17

11.2

Receiving Notification of Documentation Updates 17

11.3

Community Resources.......................................... 17

11.4

Trademarks ........................................................... 17

11.5

Electrostatic Discharge Caution ............................ 17

11.6

Glossary ................................................................ 17

12

Mechanical, Packaging, and Orderable

Information ........................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision G (May 2016) to Revision H

Page

•

Changed the value of the capacitor on the VM pin from 10 µF to 0.1 µF in the Parallel Mode Connections figure............ 12

•

Added one capacitor to the VM pin and updated the value of the existing capacitor on the VM pin in the Layout

Example................................................................................................................................................................................ 15

•

Deleted references to TI's PowerPAD package and updated it with thermal pad where applicable ................................... 16

•

Added the Receiving Notification of Documentation Updates section ................................................................................ 17

Changes from Revision F (April 2016) to Revision G

Page

•

Changed the Layout Guidelines to clarify the guidelines for the VM pin ............................................................................. 15

Changes from Revision E (December 2015) to Revision F

Page

•

Deleted nFAULT from the Simplified Schematic in the Description section ......................................................................... 1

Changes from Revision D (January 2014) to Revision E

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section .................................................................................................. 1