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SPSB100 Datasheet(PDF) 196 Page - STMicroelectronics |
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SPSB100 Datasheet(HTML) 196 Page - STMicroelectronics |
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196 / 213 page  Figure 75. Assembly bottom 10.1 PCB metal and component placement Evaluation has shown that the best overall performance is achieved using the substrate/PCB layout. QFN devices should be placed to an accuracy of 0.050 mm on both X and Y axes. Self-centering behavior is highly dependent on solders and processes, and experiments should be run to confirm the limits of self-centering on specific processes. 10.2 Solder mask We recommend that larger power or land area pads are solder mask defined (SMD). This allows the underlying copper traces to be as large as possible, which helps in terms of current carrying capability and device cooling capability. When using SMD pads, the underlying copper traces should be at least 0.05 mm larger (on each edge) than the openings in the solder mask. This allows for layers to be misaligned by up to 0.1 mm on both axes. Ensure that the solder resists in-between the smaller signal lead areas is at least 0.15 mm wide, due to the high x/y aspect ratio of the solder mask strip. SPSB100 PCB layout recommendation DS14640 - Rev 2 page 196/213 |
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