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SPSB100 Datasheet(PDF) 197 Page - STMicroelectronics |
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SPSB100 Datasheet(HTML) 197 Page - STMicroelectronics |
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197 / 213 page ![]() Figure 76. Solder mask defined (SMD) SMD Solderable PCB 10.3 Stencil design Stencils for QFN packages can be used with thicknesses of 0.100 ~ 0.250 mm (0.004 ~ 0.010”) stencils thinner than 0.100 mm are unsuitable because they deposit insufficient solder paste to make good solder joints with the ground pad; high reductions sometimes create similar problems. Stencils in the range of 0.125 mm ~ 0.200 mm (0.005 ~ 0.008”), with suitable reductions, give the best results. This design is for a stencil thickness of 0.127 mm (0.005”). The reduction should be adjusted for stencils of other thicknesses. SPSB100 PCB layout recommendation DS14640 - Rev 2 page 197/213 |
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