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LP5012 Datasheet(PDF) 49 Page - Texas Instruments |
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LP5012 Datasheet(HTML) 49 Page - Texas Instruments |
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49 / 52 page  www.ti.com PACKAGE OUTLINE C SEE TERMINAL DETAIL 20X 0.25 0.15 1.7 0.05 20X 0.5 0.3 0.8 MAX (DIM A) TYP OPT 02 SHOWN 0.05 0.00 16X 0.4 4X 1.6 A 3.1 2.9 B 3.1 2.9 0.25 0.15 0.5 0.3 WQFN - 0.8 mm max height RUK0020B PLASTIC QUAD FLATPACK - NO LEAD 4222676/A 02/2016 DIMENSION A OPTION 01 (0.1) OPTION 02 (0.2) PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 5 11 15 6 10 20 16 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD 21 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 4.000 DETAIL OPTIONAL TERMINAL TYPICAL |
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