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LP5012 Datasheet(PDF) 6 Page - Texas Instruments |
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LP5012 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 52 page ![]() Pin Functions PIN I/O DESCRIPTION NAME RUK NO. PW NO. LP5009 LP5012 LP5009 LP5012 ADDR0 14 14 1 1 — I2C slave-address selection pin. This pin must not be left floating. ADDR1 15 15 3 3 — I2C slave-address selection pin. This pin must not be left floating. EN 19 19 8 8 I Chip enable input pin. IREF 20 20 9 9 — Output current-reference global-setting pin. NC 11, 12, 13 — 22, 23, 24 — — No internal connection. OUT0 2 2 12 12 O Current sink output 0. If not used, this pin can be left floating. OUT1 3 3 13 13 O Current sink output 1. If not used, this pin can be left floating. OUT2 4 4 14 14 O Current sink output 2. If not used, this pin can be left floating. OUT3 5 5 15 15 O Current sink output 3. If not used, this pin can be left floating. OUT4 6 6 16 16 O Current sink output 4. If not used, this pin can be left floating. OUT5 7 7 17 17 O Current sink output 5. If not used, this pin can be left floating. OUT6 8 8 19 19 O Current sink output 6. If not used, this pin can be left floating. OUT7 9 9 20 20 O Current sink output 7. If not used, this pin can be left floating. OUT8 10 10 21 21 O Current sink output 8. If not used, this pin can be left floating. OUT9 — 11 — 22 O Current sink output 9. If not used, this pin can be left floating. OUT10 — 12 — 23 O Current sink output 10. If not used, this pin can be left floating. OUT11 — 13 — 24 O Current sink output 11. If not used, this pin can be left floating. SCL 18 18 7 7 I I2C bus clock line. If not used, this pin must be connected to GND or VCC. SDA 17 17 5 5 I/O I2C bus data line. If not used, this pin must be connected to GND or VCC. VCAP 1 1 10 10 — Internal LDO output pin, this pin must be connected to a 1-µF capacitor to GND. Place the capacitor as close to the device as possible. VCC 16 16 4 4 — Power supply. GND Thermal pad Thermal pad — — — Exposed thermal pad also serves the ground pin for the WQFN package. AGND — — 2 2 — Analog circuits ground. AGND, PGND and DGND must be conntected together. PGND — — 6 6 — Power ground. AGND, PGND and DGND must be conntected together. DGND — — 18 18 — Digital circuits ground. AGND, PGND and DGND must be conntected together. LP5009, LP5012 SLVSEH2B – MAY 2019 – REVISED AUGUST 2020 www.ti.com 6 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: LP5009 LP5012 |
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