OPA189IDBVT datasheet(8/58 Pages) TI2

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7.4 Thermal Information: OPA189

THERMAL METRIC(1)

OPA189

UNIT

D (SOIC)

DGK (VSSOP)

DBV (SOT)

8 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

122.0

166.4

134.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

57.6

54.2

90.5

°C/W

RθJB

Junction-to-board thermal resistance

67.3

87.9

41.9

°C/W

ΨJT

Junction-to-top characterization parameter

12.7

5.5

22.5

°C/W

ΨJB

Junction-to-board characterization parameter

66.2

86.4

41.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: OPA2189

THERMAL METRIC(1)

OPA2189

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

115.7

150.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

51.1

43.9

°C/W

RθJB

Junction-to-board thermal resistance

60.8

71.4

°C/W

ΨJT

Junction-to-top characterization parameter

9.8

2.9

°C/W

ΨJB

Junction-to-board characterization parameter

59.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.6 Thermal Information: OPA4189

THERMAL METRIC(1)

OPA4189

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

73.4

106.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

29.0

22.7

°C/W

RθJB

Junction-to-board thermal resistance

30.2

52.0

°C/W

ΨJT

Junction-to-top characterization parameter

3.5

1.0

°C/W

ΨJB

Junction-to-board characterization parameter

29.8

50.8

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA189, OPA2189, OPA4189

SBOS830I – SEPTEMBER 2017 – REVISED OCTOBER 2021

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