OPA4316IPW datasheet(8/65 Pages) TI2

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OPA316, OPA2316, OPA2316S, OPA4316

SBOS703F – APRIL 2014 – REVISED OCTOBER 2016

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Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316

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(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).

(6)

The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).

(7)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

6.7 Thermal Information: OPA4316

THERMAL METRIC(1)

OPA4316

UNIT

PW (TSSOP)

D (SOIC)

14 PINS

RθJA

Junction-to-ambient thermal resistance(2)

117.2

87.0

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance(3)

46.2

44.4

°C/W

RθJB

Junction-to-board thermal resistance(4)

58.9

41.7

°C/W

ψJT

Junction-to-top characterization parameter(5)

4.9

11.6

°C/W

ψJB

Junction-to-board characterization parameter(6)

58.3

41.4

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance(7)

N/A

°C/W

OPA4316IPW Datasheet(PDF) 8 Page - Texas Instruments

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