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OPA454 Datasheet(PDF) 2 Page - Texas Instruments

Part # OPA454
Description  OPA454 High-Voltage (100-V), High-Current (50-mA) Operational Amplifiers, G = 1 Stable
PDF  49 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

OPA454 Datasheet(HTML) 2 Page - Texas Instruments

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OPA454
SBOS391B – DECEMBER 2007 – REVISED MARCH 2016
www.ti.com
Product Folder Links: OPA454
Submit Documentation Feedback
Copyright © 2007–2016, Texas Instruments Incorporated
Table of Contents
1
Features .................................................................. 1
2
Applications ........................................................... 1
3
Description ............................................................. 1
4
Revision History..................................................... 2
5
Device Comparison Table..................................... 3
6
Pin Configuration and Functions ......................... 3
7
Specifications......................................................... 4
7.1
Absolute Maximum Ratings ...................................... 4
7.2
ESD Ratings ............................................................ 4
7.3
Recommended Operating Conditions ....................... 4
7.4
Thermal Information .................................................. 4
7.5
Electrical Characteristics: VS = ±50 V....................... 5
7.6
Typical Characteristics .............................................. 7
8
Parameter Measurement Information ................ 16
9
Detailed Description ............................................ 17
9.1
Overview ................................................................. 17
9.2
Functional Block Diagram ....................................... 17
9.3
Feature Description................................................. 18
9.4
Device Functional Modes........................................ 21
10
Application and Implementation........................ 22
10.1
Applications Information........................................ 22
10.2
Typical Application ................................................ 24
10.3
System Examples ................................................. 27
11
Power Supply Recommendations ..................... 33
12
Layout................................................................... 33
12.1
Layout Guidelines ................................................. 33
12.2
Layout Example .................................................... 35
12.3
Thermal Protection................................................ 36
12.4
Power Dissipation ................................................. 36
12.5
Heatsinking ........................................................... 37
13
Device and Documentation Support ................. 38
13.1
Device Support .................................................... 38
13.2
Documentation Support ....................................... 38
13.3
Community Resources.......................................... 39
13.4
Trademarks ........................................................... 39
13.5
Electrostatic Discharge Caution ............................ 39
13.6
Glossary ................................................................ 39
14
Mechanical, Packaging, and Orderable
Information ........................................................... 39
4 Revision History
Changes from Revision A (December 2008) to Revision B
Page
•
Added Pin Functions table, ESD Ratings table, Recommended Operating Conditions table, Thermal Information
table, Feature Description section, Device Functional Modes section, Application and Implementation section,
Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
•
Changed OPA454 Related Products table to Device Comparison table ............................................................................... 3
•
Deleted Ordering Information table ........................................................................................................................................ 3
•
Corrected symbol error in Absolute Maximum Ratings table; changed operating temperature specification from TJ to
TA ........................................................................................................................................................................................... 4
•
Changed Figure 29 title from THD+N vs Temperature to THD+N vs Frequency ................................................................ 10
•
Changed Figure 30 title from THD+N vs Temperature to THD+N vs Frequency ................................................................ 10
Changes from Original (December 2007) to Revision A
Page
•
Deleted DDA Package from title of Figure 13 ........................................................................................................................ 9
•
Deleted DDA Package from title of Figure 14 ........................................................................................................................ 9
•
Corrected mislabeled y-axis in Figure 42 ............................................................................................................................. 12
•
Corrected mislabeled y-axis in Figure 43 ............................................................................................................................. 13
•
Corrected mislabeled y-axis in Figure 44 ............................................................................................................................. 13
•
Changed statement about thermal shutdown cycling qualification studies from 400 hours to 1000 hours in Current
Limit section.......................................................................................................................................................................... 21
•
Deleted Top-Side PowerPAD Package section.................................................................................................................... 33
•
Added alternate units (.013 in, or 0.3302 mm) for measurement of recommended through-hole diameter to
PowerPAD Layout Guidelines description............................................................................................................................ 34



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