PCM186X datasheet(12/145 Pages) TI2

12 / 145 page

PCM1860, PCM1861, PCM1862

PCM1863, PCM1864, PCM1865

SLAS831D – MARCH 2014 – REVISED MARCH 2018

www.ti.com

Product Folder Links: PCM1860 PCM1861 PCM1862 PCM1863 PCM1864 PCM1865

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

AVDD to AGND

–0.3

3.9

DVDD to DGND

–0.3

3.9

IOVDD to DGND

–0.3

3.9

Ground voltage differences

AGND to DGND

–0.3

0.3

Digital input voltage

Digital input to DGND

–0.3

IOVDD + 0.3

XI to DGND

–0.3

2.1

Analog input voltage

VINxx to AGND

–1.7

5.0

Temperature

Operating ambient, TA

–40

125

°C

Junction, TJ

–40

150

Storage, Tstg

–40

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±750

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

POWER

AVDD

Analog supply voltage to AGND

3.0

3.3

3.6

DVDD

Digital supply voltage to DGND

3.0

3.3

3.6

IOVDD

IO supply voltage to DGND

at 1.8 V

1.62

1.8

1.98

at 3.3 V

3.0

3.3

3.6

LDO

LDO pin voltage to DGND

(LDO is an input when using external 1.8-V power supply)

IOVDD – 0.3

IOVDD

IOVDD + 0.3

TEMPERATURE

Operating ambient temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

PCM186x

UNIT

DBT (TSSOP)

30 PINS

RθJA

Junction-to-ambient thermal resistance

79.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

15.1

°C/W

RθJB

Junction-to-board thermal resistance

33.1

°C/W

ψJT

Junction-to-top characterization parameter

0.4

°C/W

ψJB

Junction-to-board characterization parameter

32.6

°C/W

PCM186X Datasheet(PDF) 12 Page - Texas Instruments

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