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THS4521 Datasheet(PDF) 4 Page - Texas Instruments

Part # THS4521
Description  Ultra Low Power, Rail-to-Rail Output, Fully-Differential Amplifier
PDF  58 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

THS4521 Datasheet(HTML) 4 Page - Texas Instruments

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THS4531
SLOS358C – SEPTEMBER 2011 – REVISED APRIL 2020
www.ti.com
Product Folder Links: THS4531
Submit Documentation Feedback
Copyright © 2011–2020, Texas Instruments Incorporated
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Table 2. Packaging and Ordering Information(1)
PRODUCT
CHANNEL
COUNT
PACKAGE-
LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT MEDIA,
QUANTITY
THS4531
1
SOIC-8
D
–40°C to +125°C
T4531
THS4531ID
Rails, 75
1
T4531
THS4531IDR
Tape and reel, 2500
1
VSSOP-8
DGK
–40°C to +125°C
4531
THS4531IDGK
Rails, 80
1
4531
THS4531IDGKR
Tape and reel, 2500
1
WQFN-10
RUN
–40°C to +125°C
4531
THS4531IRUNT
Tape and reel, 250
1
4531
THS4531IRUNR
Tape and reel, 3000
5 Electrical Specifications
5.1 Absolute Maximum Ratings
VALUE
UNITS
Supply voltage, VS– to VS+
5.5
Input/output voltage, VIN±, VOUT±, and VOCM pins
(VS–) – 0.7 to (VS+) + 0.7
V
Differential input voltage, VID
1
V
Continuous output current, IO
50
mA
Continuous input current, Ii
10
mA
Continuous power dissipation
See Thermal Information
Maximum junction temperature, TJ
150
°C
Operating free-air temperature range, TA
–40 to +125
°C
Storage temperature range, Tstg
–65 to +150
°C
Electrostatic
discharge (ESD)
ratings:
Human body model (HBM)
3000
V
Charge device model (CDM)
500
V
Machine model (MM)
200
V
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
5.2 Thermal Information
THERMAL METRIC(1)
THS4531
THS4531
THS4531
UNITS
SOIC
(P)
VSSOP
(MSOP)
(DGK)
WQFN
(RUN)
8 PINS
8 PINS
10 PINS
θJA
Junction-to-ambient thermal resistance
133
198
163
°C/W
θJCtop
Junction-to-case (top) thermal resistance
78
84
66
θJB
Junction-to-board thermal resistance
73
120
113
ψJT
Junction-to-top characterization parameter
26
19
17
ψJB
Junction-to-board characterization parameter
73
118
113
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
N/A
N/A



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