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TLV1805

SNOSD50A – DECEMBER 2018 – REVISED JANUARY 2020

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails must

be current-limited to 10 mA or less.

(3)

Shutdown pin is diode-clamped to (V–). Input to SHDN that can swing more than 0.3 V below (V–) must be current-limited to 10 mA or

less.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

-0.3

42

V

Input pins (IN+, IN–)(2)

(V–) – 0.3

(V+) + 0.3

V

Shutdown pin (SHDN)(3)

(V–) – 0.3

(V–) + 5.5

V

Current into Input pins (IN+, IN–, SHDN)(2)

±10

mA

Output (OUT)

(V–) – 0.3

(V+) + 0.3

V

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standaed ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (V–)

3.3

40

V

Ambient temperature, TA

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

TLV1805

UNIT

DBV (SOT23)

6 PINS

RθJA

Junction-to-ambient thermal resistance

166.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

104.2

°C/W

RθJB

Junction-to-board thermal resistance

46.8

°C/W

ψJT

Junction-to-top characterization parameter

31.3

°C/W

ψJB

Junction-to-board characterization parameter

46.6

°C/W