Figure 11. Junction capacitance versus reverse voltage

applied (typical values)

10

100

1000

1

1 0

100

1000

C(pF)

V (V)

R

F=1MHz

V

=30mV

T =25°C

OSC

RMS

j

Figure 12. Thermal resistance junction to ambient versus

copper surface under each lead

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

Rth(j-a) (°C/W)

D²PAK

Epoxy printed board FR4, copper thickness = 35 µm

SCu(cm²)

STTH1512-Y

Characteristics (curves)

DS9417 - Rev 2

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