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TMS320F28030 Datasheet(PDF) 29 Page - Texas Instruments

Part # TMS320F28030
Description  TMS320F2803x Real-Time Microcontrollers
PDF  175 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TMS320F28030 Datasheet(HTML) 29 Page - Texas Instruments

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6.7.3 RSH Package
°C/W(1)
AIR FLOW (lfm)(2)
RΘJC
Junction-to-case thermal resistance
14.7
N/A
RΘJB
Junction-to-board thermal resistance
9.2
N/A
RΘJA
(High k PCB)
Junction-to-free air thermal resistance
34.8
0
23.6
150
22.3
250
20.5
500
PsiJT
Junction-to-package top
0.24
0
0.36
150
0.43
250
0.56
500
PsiJB
Junction-to-board
9.2
0
8.8
150
8.9
250
8.8
500
(1)
These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
•
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
•
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(2)
lfm = linear feet per minute
6.8 Thermal Design Considerations
Based on the end application design and operational profile, the IDD and IDDIO currents could vary. Systems
that exceed the recommended maximum power dissipation in the end product may require additional thermal
enhancements. Ambient temperature (TA) varies with the end application and product design. The critical factor
that affects reliability and functionality is TJ, the junction temperature, not the ambient temperature. Hence, care
should be taken to keep TJ within the specified limits. Tcase should be measured to estimate the operating
junction temperature TJ. Tcase is normally measured at the center of the package top-side surface. The thermal
application report Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and
definitions.
www.ti.com
TMS320F28030, TMS320F28030-Q1, TMS320F28031, TMS320F28031-Q1, TMS320F28032
TMS320F28032-Q1, TMS320F28033, TMS320F28033-Q1, TMS320F28034, TMS320F28034-Q1
TMS320F28035, TMS320F28035-Q1
SPRS584Q – APRIL 2009 – REVISED JANUARY 2024
Copyright © 2024 Texas Instruments Incorporated
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Product Folder Links: TMS320F28030 TMS320F28030-Q1 TMS320F28031 TMS320F28031-Q1 TMS320F28032 TMS320F28032-Q1
TMS320F28033 TMS320F28033-Q1 TMS320F28034 TMS320F28034-Q1 TMS320F28035 TMS320F28035-Q1



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