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TSV911, TSV912, TSV914

SBOS878D – JULY 2017 – REVISED OCTOBER 2019

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Product Folder Links: TSV911 TSV912 TSV914

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Copyright © 2017–2019, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Device Comparison Table..................................... 4

6

Pin Configuration and Functions ......................... 5

7

Specifications......................................................... 8

7.1

Absolute Maximum Ratings ...................................... 8

7.2

ESD Ratings.............................................................. 8

7.3

Recommended Operating Conditions ....................... 8

7.4

Thermal Information: TSV911 ................................... 8

7.5

Thermal Information: TSV912 ................................... 9

7.6

Thermal Information: TSV914 ................................... 9

7.7

Electrical Characteristics: VS (Total Supply Voltage) =

(V+) – (V–) = 2.5 V to 5.5 V ..................................... 10

7.8

Typical Characteristics ............................................ 12

8

Detailed Description ............................................ 18

8.1

Overview ................................................................. 18

8.2

Functional Block Diagram ....................................... 18

8.3

Feature Description................................................. 19

8.4

Device Functional Modes........................................ 19

9

Application and Implementation ........................ 20

9.1

Application Information............................................ 20

9.2

Typical Application .................................................. 20

10

Power Supply Recommendations ..................... 22

10.1

Input and ESD Protection ..................................... 22

11

Layout................................................................... 23

11.1

Layout Guidelines ................................................. 23

11.2

Layout Example .................................................... 23

12

Device and Documentation Support ................. 24

12.1

Documentation Support ........................................ 24

12.2

Related Links ........................................................ 24

12.3

Receiving Notification of Documentation Updates 24

12.4

Community Resources.......................................... 24

12.5

Trademarks ........................................................... 24

12.6

Electrostatic Discharge Caution ............................ 24

12.7

Glossary ................................................................ 24

13

Mechanical, Packaging, and Orderable

Information ........................................................... 24

4 Revision History

Changes from Revision C (January 2019) to Revision D

Page

•

Added SOT-23 (8) (DDF) package information to data sheet................................................................................................ 1

Changes from Revision B (April 2018) to Revision C

Page

•

Deleted preview notations for TSV911IDBV ......................................................................................................................... 1

•

Added SC70 package information to Device Information table.............................................................................................. 1

•

Deleted package preview notation from TSV911 DBV (SOT-23) package ........................................................................... 4

•

Added DCK (SC70) package information to Device Comparison Table ................................................................................ 4

•

Deleted TSV911 DBV (SOT-23) package preview notation from Pin Configuration and Functions section.......................... 5

•

Added TSV911 DCK (SC70) package drawing and pin functions ........................................................................................ 5

•

Added TSV911 DBV and DCK package thermal information................................................................................................. 8

Changes from Revision A (October 2017) to Revision B

Page

•

Changed TSV914 14-pin TSSOP package from preview to production data in Device Information table ............................ 1

•

Deleted package preview note from 8-pin WSON package in Device Information table ...................................................... 1

•

Deleted package preview note from PW (TSSOP) package from Device Comparison table ............................................... 4

•

Deleted package preview note from DSG (WSON) package from Device Comparison table ............................................... 4

•

Deleted package preview note from TSV912 DSG package pinout drawing in Pin Configuration and Functions section .... 6

•

Added DGK (VSSOP) thermal information to Thermal Information: TSV912 table .............................................................. 9

•

Deleted package preview note to TSV914 PW (TSSOP) package Thermal Information table.............................................. 9

•

Added PW (TSSOP) package information to Thermal Information: TSV914 table ................................................................ 9

•

Changed TSV914 PW (TSSOP) junction-to-ambient thermal resistance from 135.8°C/W to 205.8°C/W ............................. 9

•

Changed TSV914 PW (TSSOP) junction-to-case(top) thermal resistance from 64°C/W to 106.7°C/W................................ 9

•

Changed TSV914 PW (TSSOP) junction-to-board thermal resistance from 79°C/W to 133.9°C/W...................................... 9