TDA2SA datasheet(180/427 Pages) TI2

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vssa_osc0

Device

xo_osc0

xi_osc0

SPRS85v_CLK_09

180

TDA2SX, TDA2SG, TDA2SA

TDA2HG, TDA2HV, TDA2HF, TDA2LF

SPRS951F – DECEMBER 2015 – REVISED MAY 2019

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Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF

Clock Specifications

Table 6-1. OSC0 Crystal Electrical Characteristics (continued)

NAME

DESCRIPTION

MIN

TYP

MAX

UNIT

Crystal motional inductance for fp = 20 MHz

10.16

Crystal motional capacitance

3.42

tj(xiosc0)

Frequency accuracy (1), xi_osc0

Ethernet and MLB not used

±200

ppm

Ethernet RGMII and RMII

using derived clock

±50

Ethernet MII using derived

clock

±100

MLB using derived clock

±50

(1) Crystal characteristics should account for tolerance+stability+aging.

When selecting a crystal, the system design must take into account the temperature and aging

characteristics of a crystal versus the user environment and expected lifetime of the system.

Table 6-2 details the switching characteristics of the oscillator and the requirements of the input clock.

Table 6-2. Oscillator Switching Characteristics—Crystal Mode

NAME

DESCRIPTION

MIN

TYP

MAX

UNIT

Oscillation frequency

19.2, 20, 27 MHz

MHz

tsX

Start-up time

6.1.2.2

OSC0 Input Clock

A 1.8-V LVCMOS-Compatible Clock Input can be used instead of the internal oscillator to provide the

SYS_CLK1 clock input to the system. The external connections to support this are shown in Figure 6-4.

The xi_osc0 pin is connected to the 1.8-V LVCMOS-Compatible clock source. The xi_osc0 pin is left

unconnected. The vssa_osc0 pin is connected to board ground (VSS).

Figure 6-4. 1.8-V LVCMOS-Compatible Clock Input

Table 6-3 summarizes the OSC0 input clock electrical characteristics.

Table 6-3. OSC0 Input Clock Electrical Characteristics—Bypass Mode

NAME

DESCRIPTION

MIN

TYP

MAX

UNIT

Frequency

19.2, 20, 27

MHz

CIN

Input capacitance

2.184

2.384

2.584

IIN

Input current (3.3V mode)

µA

TDA2SA Datasheet(PDF) 180 Page - Texas Instruments

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