MP5026

– 16V, 20A, 2.8mΩ RDS(ON), HOT-SWAP INTELLI-FUSE SOLUTION

MP5026 Rev. 1.0

MonolithicPower.com

5

7/5/2023

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ABSOLUTE MAXIMUM RATINGS (1)

VIN (DC).........................................-0.3V to +20V

VIN (1μs) ....................................................... 24V

VIN (25ns) ..................................................... 29V

VOUT...............................................-0.3V to +20V

VOUT (200ns) .............................................. -1.5V

All other pins ................................-0.3V to +4.2V

Continuous power dissipation (TA = 25°C) (2)

................................................................. 4.09W

Junction temperature (TJ) .........................150°C

Lead temperature .....................................260°C

Storage temperature ................ -65°C to +155°C

ESD Ratings (3)

Human body model (HBM)...................Class 1C

Charged-device model (CDM)...........Class C2B

Recommended Operating Conditions (4)

Input voltage (VIN) ............................2.7V to 16V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance (5)

θJA

θJC

TLGA-26 (4mmx4mm) .......... 30.5 ....26.3 . °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature, TJ (MAX), the junction-to-

ambient

thermal

resistance,

θ

JA,

and

the

ambient

temperature, TA. The maximum allowable continuous power

dissipation at any ambient temperature is calculated by PD

(MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum

allowable power dissipation can produce an excessive die

temperature, which may cause the regulator to go into

thermal

shutdown.

Internal

thermal

shutdown

circuitry

protects the device from permanent damage.

3) Followed

ANSI/ESDA/JEDEC

JS-001

for

HBM

and

ANSI/ESDA/JEDEC JS-002 for CDM.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on a JESD51-7, 4-layer PCB.