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30.0-46.0 GHz GaAs MMIC

Receiver

Mechanical Drawing

Bias Arrangement

Bypass Capacitors - See App Note [2]

(Note: Engineering designator is 40REC0452)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC/IF Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.987 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vd1)

Bond Pad #9 (Vg4)

Bond Pad #10 (IF2)

Bond Pad #3 (Vd2)

Bond Pad #4 (IF1)

Bond Pad #5 (Vd3)

Bond Pad #6 (LO)

Bond Pad #7 (Vg5)

Bond Pad #8 (Vg3)

Bond Pad #11 (Vg2)

Bond Pad #12 (Vg1)

1

2

3

4

5

6

7

8

9

0.298

(0.012)

1.620

(0.064)

1.170

(0.046)

1.571

(0.062)

1.871

(0.074)

2.470

(0.097)

3.071

(0.121)

3.970

(0.156)

2.271

(0.089)

1.571

(0.062)

0.646

(0.025)

2.671

(0.105)

1.871

(0.074)

1.170

(0.046)

0.0

0.0

10

11

12

2

3

4

5

6

7

8

9

10

11

12

Vg5

Vg3

Vg4

Vg1

Vg2

IF2

RF Out

IF1

Vd3

Vd1

Vd2

XR1004-BD

Vd1,2

Vd3

IF1

LO

Vg5

IF2

Vg3

Vg4

Vg1,2

RF

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Characteristic Data and Specifications are subject to change without notice.

©2007 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

August 2007 - Rev 16-Aug-07

R1004-BD