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MBRB20150 Datasheet(PDF) 3 Page - Guangdong Huixin Electronic Technology Co., Ltd. |
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MBRB20150 Datasheet(HTML) 3 Page - Guangdong Huixin Electronic Technology Co., Ltd. |
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3 / 3 page ![]() Package Information BACK VIEW HEAT-SINK PLANE E e A b1 L A c1 c TO-263 Package Outline Dimension A1 2 ×b UNIT: mm Symbol A 4.83 4.06 b c c1 D E e L L1 MIN NOM MAX 4.60 0.94 0.69 0.81 0.51 0.36 0.38 1.40 1.14 1.27 9.50 8.60 9.00 10.6 9.65 10.1 7.0 5.08 BSC H 15.8 14.6 15.1 2.6 2.0 2.2 1.40 1.19 1.26 8.5 7.8 L2 7.00 8.10 7.50 b1 A1 0.02 Recommended Solder Pad Layout UNIT: mm(inches) 10.2( 0.400) 5.08( 0.200) 4.06×1.27 (0.160×0.050) www.hxkj.hk +86-769-22857832 huixin@hxkj.hk Rev.01 Page 3 of 3 |
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