PS8802-1,-2 Data Sheet

R08DS0258EJ0100 Rev.1.00

Page 10 of 13

Dec 9, 2021

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

• Peak reflow temperature

260

°C or below (package surface temperature)

• Time of peak reflow temperature

10 seconds or less

• Time of temperature higher than 220

°C

60 seconds or less

• Time to preheat temperature from 120 to 180

°C 120 ± 30 s

• Number of reflows

Three

• Flux

Rosin flux containing small amount of chlorine

(The flux with a maximum chlorine content of

0.2 Wt% is recommended.)

(2) Wave soldering

• Temperature

260

°C or below (molten solder temperature)

• Time

10 seconds or less

• Preheating conditions

120

°C or below (package surface temperature)

• Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

• Flux

Rosin flux containing small amount of chlorine (The flux with a maximum

chlorine content of 0.2 Wt% is recommended.)

(3) Soldering by Soldering Iron

• Peak Temperature (lead part temperature) 350

°C or below

• Time (each pins)

3 seconds or less

• Flux

Rosin flux containing small amount of chlorine

(The flux with a maximum chlorine content of 0.2 Wt% is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead

(b) Please be sure that the temperature of the package would not be heated over 100

°C

(4) Cautions

• Flux Cleaning

Avoid cleaning with Freon based or halogen-based (chlorinated etc.) solvents.

• Do not use fixing agents or coatings containing halogen-based substances.

2. Cautions regarding noise

Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between

collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the

absolute maximum ratings.

120±30 s

(preheating)

220°C

180°C

Time (s)

Recommended Temperature Profile of Infrared Reflow

(heating)

to 10 s

to 60 s

260°C MAX.

120°C