 2024-2026 Microchip Technology Inc. and its subsidiaries

DS20005820B-page 19

HV232

RECOMMENDED LAND PATTERN

SILK SCREEN

C1

C2

E

X1

Y1

G

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Microchip Technology Drawing C04-2026-L4X Rev D

28-Lead Plastic Leaded Chip Carrier (L4X) - Square [PLCC]

Dimension Limits

Units

C2

Contact Pad Spacing

Contact Pitch

INCHES

.050 BSC

MIN

E

MAX

.425

Contact Pad Length (X28)

Contact Pad Width (X28)

Y1

X1

.100

.026

NOM

C1

Contact Pad Spacing

.425

Contact Pad to Center Pad (X24)

G

.008

MILLIMETERS

1.27 BSC

MIN

MAX

10.80

2.54

0.66

NOM

10.80

0.20