© 2005 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FST3125 • Rev. 1.0.3

8

Physical Dimensions

C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,

AND TIE BAR EXTRUSIONS

F. DRAWING FILE NAME: MTC14REV6

R0.09 min

12.00°

TOP & BOTTOM

0.43 TYP

1.00

D. DIMENSIONING AND TOLERANCES PER ANSI

Y14.5M, 1982

R0.09min

E. LANDPATTERN STANDARD: SOP65P640X110-14M

0.65

6.10

1.65

0.45

A. CONFORMS TO JEDEC REGISTRATION MO-153,

VARIATION AB, REF NOTE 6

B. DIMENSIONS ARE IN MILLIMETERS

Figure 8. 14-Lead, Thin Shrink Small Outline Package (TSSOP) MO-153, 4mm Wide

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the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

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