INTEGRATED CIRCUITS DIVISION

CPC1981Y

www.ixysic.com

5

R08

Manufacturing Information

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Soldering Profile

The Maximum Solder Temperature and the Maximum Total Dwell Time in all solder waves the device pins (leads)

may be at the Maximum Solder Temperature is given in the table below. The body temperature of the device must not

exceed the Maximum Body Temperature shown below at any time during the soldering process.

Device

Maximum Solder Temperature

Maximum Body Temperature

Maximum Total Dwell Time

Wave Cycles

CPC1981Y

260ºC

245ºC

10 seconds

1

Board Wash

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux

residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage

to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow

up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the

variability of the wash parameters used to clean the board, determination of the bake temperature and duration

necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning

or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the

device must not be exposed to halide flux or solvents.