MAX97003 datasheet(21/48 Pages) AD

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MAX97003

High-Efficiency, Low-Noise Audio Subsystem

Bump Configuration

Bump Description

BUMP

NAME

FUNCTION

C1N

Charge-Pump Flying Capacitor Negative Terminal. Connect a 1FF capacitor between C1P and C1N.

C1P

Charge-Pump Flying Capacitor Positive Terminal. Connect a 1FF capacitor between C1P and C1N.

CPVSS

Headphone Amplifier Negative Power Supply. Bypass with a 1FF capacitor to PGND.

HPR

Headphone Amplifier Right Output

HPL

Headphone Amplifier Left Output

GND

Analog Ground

SCL

Serial Clock Input. Connect a pullup resistor from SCL to the I2C bus supply.

CPVDD

Headphone Amplifier Positive Power Supply. Bypass with a 1FF capacitor to PGND.

HPSNS

Headphone Ground Sense. Connect to the headset jack’s ground terminal.

BIAS

Common-Mode Bias. Bypass to GND with a 1FF capacitor.

PVDD

Speaker Amplifier Power Supply. Bypass with a 0.1FF and a 10FF capacitor to PGND.

SDA

Serial-Data Input/Output. Connect a pullup resistor from SDA to the I2C bus supply.

VDD

Headphone Amplifier Supply. Bypass with a 0.1FF and a 10FF capacitor to GND.

INB1

Input B1. Left or negative input.

INB2

Input B2. Right or positive input.

SPKP

Positive Speaker Output

SPKN

Negative Speaker Output

PGND

Speaker Amplifier Ground and Charge-Pump Ground

INA1

Input A1. Left or negative input.

INA2

Input A2. Right or positive input.

C1P

CPVSS

HPR

C1N

SCL

CPVDD

HPSNS

GND

SDA

VDD

TOP VIEW

(BUMP SIDE DOWN)

WLP

HPL

BIAS

INB2

PVDD

SPKN

PGND

INA1

INA2

SPKP

INB1

MAX97003

MAX97003 Datasheet(PDF) 21 Page - Analog Devices

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