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XC6201 Datasheet(PDF) 24 Page - Torex Semiconductor |
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XC6201 Datasheet(HTML) 24 Page - Torex Semiconductor |
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24 / 27 page  24/27 XC6201 Series ● USP-6B Power Dissipation Power dissipation data for theUSP-6B is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. 1. Measurement Condition Condition： Mount on a board Ambient： Natural convection Soldering： Lead (Pb) free Board： Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material： Glass Epoxy (FR-4) Thickness： 1.6mm Through-hole： 4 x 0.8 Diameter Evaluation Board (Unit：mm) 2.Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125℃) Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W) 25 1000 100.00 85 400 0 200 400 600 800 1000 1200 25 45 65 85 105 125 Ambient Temperature Ta (℃) Pd vs. Ta |
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