PS9905 Data Sheet

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R08DS0058EJ0200 Rev.2.00

Page 15 of 19

Jun. 30, 2021

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

• Peak reflow temperature

260

C or below (package surface temperature)

• Time of peak reflow temperature

10 seconds or less

• Time of temperature higher than 220

C

60 seconds or less

• Time to preheat temperature from 120 to 180

C

120

 30 s

• Number of reflows

Three

• Flux

Rosin flux containing small amount of chlorine (The

flux with a maximum chlorine content of 0.2 Wt% is

recommended.)

(2) Wave soldering

• Temperature

260

C or below (molten solder temperature)

• Time

10 seconds or less

• Preheating conditions 120

C or below (package surface temperature)

• Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

•

Flux

Rosin flux containing small amount of chlorine (The flux with a maximum

chlorine content of 0.2 Wt% is recommended.)

(3) Soldering by Soldering Iron

• Peak Temperature (lead part temperature)

350

C or below

• Time (each pins)

3 seconds or less

• Flux

Rosin flux containing small amount of chlorine

(The flux with a maximum chlorine content of 0.2 Wt% is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead

(b) Please be sure that the temperature of the package would not be heated over 110

C

(4) Cautions

• Flux Cleaning

Avoid cleaning with Freon based or halogen-based (chlorinated etc.) solvents.

• Do not use fixing agents or coatings containing halogen-based substances.

220°C

Time (s)

(heating)

to 10 s

to 60 s

260°CMAX.

Recommended Temperature Profile of Infrared Reflow

120±30 s

(preheating)

180°C

120°C