ISL8485, ISL8490, ISL8491

FN6046 Rev 10.02

Page 5 of 15

Oct 2, 2023

Absolute Maximum Ratings

Thermal Information

VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V

Input Voltages

DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)

Input/Output Voltages

A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V

RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)

Short Circuit Duration

Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous

ESD Rating

HBM (Per MIL-STD-883, Method 3015.7) . . . . . . . . . . . . . . >7kV

Operating Conditions

Temperature Range

ISL84XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C

ISL84XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C

Thermal Resistance (Typical, Note 5)

JA (°C/W)

8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .

170

8 Ld PDIP Package (Note 6) . . . . . . . . . . . . . . . . . .

140

14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .

120

Moisture Sensitivity (see TB363)

All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1

Maximum Junction Temperature (Plastic Package) . . . . . . +150°C

Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C

Pb-Free Reflow Profile (SOIC only). . . . . . . . . . . . . . . . . see TB493

CAUTION: Stresses above those listed in Absolute Maximum Ratings can permanently damage the device. This is a stress only rating.Operation of the device at these

or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

5.

JA is measured with the component mounted on a low-effective thermal conductivity test board in free air. See TB379 for details.

6. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

Electrical Specifications Test Conditions: VCC = 4.5V to 5.5V; unless otherwise specified. Typical values are at VCC = 5V,

TA = +25°C, Note 7

PARAMETER

SYMBOL

TEST CONDITIONS

TEMP

(°C)

MIN

TYP

MAX

UNIT

DC CHARACTERISTICS

Driver Differential VOUT (No Load)

VOD1

Full

-

-

VCC

V

Driver Differential VOUT (with

Load)

VOD2

R = 50Ω (RS-422), Figure 1

Full

2

3

-

V

R = 27Ω (RS-485), Figure 1

Full

1.5

2.3

5

V

Change in Magnitude of Driver

Differential VOUT for

Complementary Output States

VOD

R = 27Ω or 50Ω, Figure 1

Full

-

0.01

0.2

V

Driver Common-Mode VOUT

VOC

R = 27Ω or 50Ω, Figure 1

Full

-

-

3

V

Change in Magnitude of Driver

Common-Mode VOUT for

Complementary Output States

VOC

R = 27Ω or 50Ω, Figure 1

Full

-

0.01

0.2

V

Logic Input High Voltage

VIH

DE, DI, RE

Full

2

-

-

V

Logic Input Low Voltage

VIL

DE, DI, RE

Full

-

-

0.8

V

Logic Input Current

IIN1

DI (ISL8485, ISL8490, ISL8491)

Full

-2

-

2

µA

IIN1

DE, RE (ISL8485, ISL8491)

Full

-25

-

25

µA

Input Current (A, B), Note 10

IIN2

DE = 0V, VCC = 0V or

4.5 to 5.5V

VIN = 12V

Full

-

-

1

mA

VIN = -7V

Full

-

-

-0.8

mA

Receiver Differential Threshold

Voltage

VTH

-7V ≤ VCM ≤ 12V

Full

-0.2

-

0.2

V

Receiver Input Hysteresis

VTH

VCM = 0V

25

-

70

-

mV

Receiver Output High Voltage

VOH

IO = -4mA, VID = 200mV

Full

3.5

-

-

V

Receiver Output Low Voltage

VOL

IO = -4mA, VID = 200mV

Full

-

-

0.4

V

Three-State (high impedance)

Receiver Output Current

IOZR

0.4V ≤ VO ≤ 2.4V

Full

-

-

1µA

Receiver Input Resistance

RIN

-7V ≤ VCM ≤ 12V

Full

12

-

-

kΩ