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RX140 Datasheet(PDF) 1 Page - Renesas Technology Corp

Part # RX140
Description  Renesas MCUs
PDF  121 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

RX140 Datasheet(HTML) 1 Page - Renesas Technology Corp

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Datasheet
R01DS0379EJ0120 Rev.1.20
Page 1 of 121
Nov 22, 2024
RX140 Group
Renesas MCUs
Features
■ 32-bit RXv2 CPU core
 Maximum operating frequency: 48 MHz
Capable of 204 Coremark in operation at 48 MHz
 Enhanced DSP instructions: 32-bit multiply-accumulate instructions,
and 16-bit multiply-subtract instructions are supported.
 On-chip FPU: 32-bit single-precision floating point compliant with
IEEE-754
 On-chip divider that operated at the fastest of two clock cycles
 Fast interrupt
 CISC Harvard architecture with 5-stage pipeline
 Variable-length instructions, ultra-compact code
 On-chip debugging circuit
■ Low power design and architecture
 Operation from a single 1.8-V to 5.5-V supply
 Four low power consumption modes
 Low power timer (LPT) that operates during the software standby state
 Supply current
High-speed operating mode: 58 µA/MHz
Supply current in software standby mode: 0.25 µA (typ.) (Ta = 25°C)
 Recovery time from software standby mode: 6.2 µs (typ.) (Clock
Source: HOCO 32 MHz, Ta = 25°C)
■ On-chip flash memory for code
 64 K/128 K/256 Kbytes size capacities
 User code is programmable by on-board programming.
 Programmable at 1.8 V
 For instructions and operands
■ On-chip data flash memory
 4K/8 Kbytes (1,000,000 program/erase cycles (typ.))
 BGO (Background Operation)
■ On-chip SRAM, no wait states
 16 K/32 K/64 Kbytes size capacities
■ DTC
 Five transfer modes
■ ELC
 Module operation can be initiated by event signals without using
interrupts.
 Linked operation between modules is possible while the CPU is sleeping.
■ Reset and supply management
 Seven types of reset, including the power-on reset (POR)
 Low voltage detection (LVD) with voltage settings
■
Clock functions
 External clock input frequency: Up to 20 MHz
 Main clock oscillator frequency: 1 to 20 MHz
 Sub clock oscillator frequency: 32.768 kHz
 PLL circuit input: 4 MHz to 12 MHz
 Low-speed on-chip oscillator: 4 MHz
 High-speed on-chip oscillator: 24/32/48 MHz ± 1%
 IWDT-dedicated on-chip oscillator: 15 kHz
 Generate a 32.768 kHz clock for the real-time clock
 On-chip clock frequency accuracy measurement circuit (CAC)
■ Realtime clock
 Adjustment functions (30 seconds, leap year, and error)
 Calendar count mode or binary count mode selectable
■ Independent watchdog timer
 15-kHz on-chip oscillator produces a dedicated clock signal to drive
IWDT operation.
■ Useful functions for IEC60730 compliance
 Self-diagnostic and disconnection-detection assistance functions for
the A/D converter, clock frequency accuracy measurement circuit,
independent watchdog timer, RAM test assistance functions using the
DOC, etc.
■ MPC
 Input/output functions selectable from multiple pins
■ Up to 9 communication functions
 One channel of CAN module compliant with ISO11898-1: Transfer at
up to 1 Mbps
 SCI with many useful functions (up to 6 channels)
Asynchronous mode (Fine adjustable baud rate: 0 to 255/255), clock
synchronous mode, smart card interface mode
 I2C bus interface: Transfer at up to 400 kbps, capable of SMBus
operation (one channel)
 RSPI (one channel): Transfer at up to 16 Mbps
■ Up to 12 extended-function timers
 16-bit MTU: input capture, output compare, complementary PWM
output, phase counting mode (six channels)
 8-bit TMR (four channels)
 16-bit compare-match timers (two channels)
■ 12-bit A/D converter
 Capable of conversion within 0.67 µs
 17 (external pin input) +1 (internal input) channels
 Sampling time can be set for each channel
 Conversion results compare features
 Self-diagnostic function and analog input disconnection detection
assistance function
 Double trigger (data duplication) function for motor control
■ D/A converter
 Two channels
■ Capacitive touch sensing unit
 Self-capacitance method: A single pin configures a single key,
supporting up to 36 keys
 Mutual capacitance method: Matrix configuration with 8 × 8, supporting
up to 64 keys
■ Comparator B
 Two channels
■ General I/O ports
 5-V tolerant, open drain, input pull-up
■ Encryption functions (optional)
 AES (key lengths: 128 and 256 bits)
 RNG (True random number generator)
■ Temperature sensor
■ Unique ID
 32-byte ID code for the MCU
■ Operating temperature range
 –40 to +85°C
 –40 to +105°C
■ Applications
 General industrial and consumer equipment
PLQP0080KB-B 12 × 12mm, 0.5mm pitch
PLQP0064GA-A 14 × 14mm, 0.8mm pitch
PLQP0064KB-C 10 × 10mm, 0.5mm pitch
PLQP0048KB-B
7 × 7mm, 0.5mm pitch
PLQP0032GB-A
7 × 7mm, 0.8mm pitch
PWQN0048KC-A 7 × 7mm, 0.5mm pitch
PWQN0032KE-A 5 × 5mm, 0.5mm pitch
48-MHz, 32-bit RX MCUs, on-chip FPU, 204 Coremark, up to 256-KB flash memory,
up to 36 pins capacitive touch sensing unit, up to 9 comms channels, 12-bit A/D, D/A, RTC,
IEC60730 compliance, 1.8-V to 5.5-V single supply, Encryption functions (optional)
R01DS0379EJ0120
Rev.1.20
Nov 22, 2024


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