SIM689XM datasheet(28/55 Pages) SANKEN

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SIM689xM Series

SIM689xM-DSE Rev.3.4

SANKEN ELECTRIC CO., LTD.

Mar. 05, 2024

https://www.sanken-ele.co.jp/en

operational waveforms. In case of overheating (e.g.,

increased power dissipation due to overload, or elevated

ambient temperature at the device), the IC shuts down

the low-side output transistors.

LINx

HINx

TJ(MIC)

HOx

LOx

LOx responds to input signal.

TDH

TDL

TSD operation

Figure 12-16.

TSD Operational Waveforms

The TSD circuit in the low-side MIC monitors

temperatures (see Section 7). When the temperature of

the

low-side

MIC

exceeds

the

TSD

Operating

Temperature (TDH = 150 °C), the TSD circuit is

activated. When the temperature of the low-side MIC

decreases

the

TSD

Releasing

Temperature

(TDL = 120 °C) or less, the shutdown condition is

released. The output transistors then resume operating

according to input signals. During the TSD operation,

the FO pin becomes logic low and transmits fault signals.

Note that junction temperatures of the output transistors

themselves are not monitored; therefore, do not use the

TSD function as an overtemperature prevention for the

output transistors.

13. Design Notes

13.1 PCB Pattern Layout

Figure 13-1 shows a schematic diagram of a motor

drive circuit. The circuit consists of current paths having

high frequencies and high voltages, which also bring

about negative influences on IC operation, noise

interference, and power dissipation. Therefore, PCB

trace layouts and component placements play an

important role in circuit designing.

Current loops, which have high frequencies and high

voltages, should be as small and wide as possible, in

order to maintain a low-impedance state. In addition,

ground traces should be as wide and short as possible so

that radiated EMI levels can be reduced.

VBB

LS3A

LS2

MIC

VDC

High-frequency, high-voltage

current loops should be as

small and wide as possible.

Ground traces

should be wide

and short.

LS1

Figure 13-1.

High-frequency, High-voltage Current

Paths

13.2 Considerations in Heatsink Mounting

The following are the key considerations and the

guidelines for mounting a heatsink:

● Be sure to use a metric screw of M2.5 and a plain

washer of 6.0 mm (φ). When tightening the screws,

use a torque screwdriver and tighten them within the

range of screw torque defined in Section 4. Be sure to

avoid uneven tightening. Temporarily tighten the two

screws first, then tighten them equally on both sides

until the specified screw torque is reached.

● When mounting a heatsink, it is recommended to use

silicone greases. If a thermally conductive sheet or an

electrically insulating sheet is used, package cracks

may be occurred due to creases at screw tightening.

Therefore, you should conduct thorough evaluations

before using these materials.

● When applying a silicone grease, make sure that there

are no foreign substances between the IC and a

heatsink. Extreme care should be taken not to apply a

silicone grease onto any device pins as much as

possible. The following requirements must be met for

proper grease application:

- Grease thickness: 100 μm

- Heatsink flatness: ±100 µm

- Apply a silicone grease within the area indicated in

Figure 13-2, below.

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