Chip Resistor Surface Mount

www.yageo.com

Mar. 26, 2021 V.8

Product specification

4

10

SERIES

AF

0100 to 2512

overcoat

primary glass layer

resistive layer

(Jumper chip is a conductor)

inner electrode

termination(Ni/matte tin)

ceramic substrate

marking layer

overcoat

inner electrode

YNSC086

W

L

I1

H

I2

Fig. 8 Chip resistor outlines

O

OU

UT

TL

LIIN

NE

ES

S

For dimensions see Table 1

CONSTRUCTION

The resistors are constructed on top of a high grade

ceramic body. Internal metal electrodes are added at

each end and connected by a resistive glaze. The

resistive glaze is covered by a glass.

The composition of the glaze is adjusted to give the

approximate required resistance value and laser trimming

of this resistive glaze achieves the value within tolerance.

The whole element is covered by a protective overcoat.

Size 0603 and bigger is marked with the resistance value

on top. Finally, the two external terminations (Ni / matte

tin) are added. See fig.8

DIMENSIONS

TYPE

L (mm) W (mm) H (mm) I1 (mm) I2 (mm)

AF0100 0.40±0.02 0.20±0.02 0.14±0.02 0.10±0.03 0.10±0.03

AF0201 0.60±0.03 0.30±0.03 0.23±0.03 0.12±0.05 0.15±0.05

AF0402 1.00±0.05 0.50±0.05 0.35±0.05 0.20±0.10 0.25±0.10

AF0603 1.60±0.10 0.80±0.10 0.45±0.10 0.25±0.15 0.25±0.15

AF0805 2.00±0.10 1.25±0.10 0.50±0.10 0.35±0.20 0.35±0.20

AF1206 3.10±0.10 1.60±0.10 0.55±0.10 0.45±0.20 0.50±0.20

AF1210 3.10±0.10 2.60±0.15 0.57±0.10 0.45±0.20 0.50±0.20

AF1218 3.10±0.10 4.60±0.10 0.57±0.10 0.45±0.20 0.50±0.20

AF2010 5.00±0.10 2.50±0.15 0.57±0.10 0.55±0.20 0.55±0.20

AF2512 6.35±0.10 3.20±0.15 0.57±0.10 0.60±0.20 0.60±0.20

Table 1 For outlines see fig. 8