RT9193 datasheet(9/14 Pages) RICHTEK

9 / 14 page

RT9193

DS9193-11 May 2008

www.richtek.com

For recommended operating conditions specification of

RT9193, where TJ(MAX) is the maximum junction

temperature of the die (125

°C) and TA is the maximum

ambient temperature. The junction to ambient thermal

resistance (

θJA is layout dependent) for TSOT-23-5/

SOT-23-5 package is 250

°C/W, SC-70-5 package is 333°C/

W, WDFN-6L 2x2 package is 165

°C/W and MSOP-8

package is 160

°C/W on standard JEDEC 51-3 thermal

test board. The maximum power dissipation at TA= 25

°C

can be calculated by following formula :

PD(MAX) = (125

°C−25°C) / 333 = 300mW for SC-70-5

PD(MAX) = (125

°C−25°C) / 250 = 400mW for TSOT-23-5/

SOT-23-5

PD(MAX) = (125

°C−25°C) / 165 = 606mW for WDFN-6L 2x2

PD(MAX) = (125

°C−25°C) / 160 = 625mW for MSOP-8

The maximum power dissipation depends on operating

ambient temperature for fixed TJ(MAX) and thermal

resistance

θJA. For RT9193 packages, the Figure 2 of

derating curves allows the designer to see the effect of

rising ambient temperature on the maximum power

allowed.

Figure 2. Derating Curve for Packages

100

200

300

400

500

600

700

100

125

Ambient Temperature (°C)

TSOT-23-5/

SOT-23-5

SC 70-5

WDFN-6L 2x2

MSOP-8

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