ISO15 datasheet(9/20 Pages) TI

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DEVICE INFORMATION

PACKAGE CHARACTERISTICS

ISO15

ISO35

www.ti.com................................................................................................................................................................ SLOS580B – MAY 2008 – REVISED JULY 2008

Table 1. Driver Function Table

ENABLE

INPUT

OUTPUTS

(D)

VCC1

VCC2

(DE)

A or Y

B or Z

OPEN

Table 2. Receiver Function Table

DIFFERENTIAL INPUT

ENABLE

OUTPUT

VCC1

VCC2

VID = (VA – VB)

(RE)

(R)

–0.01 V

≤ VID

–0.2 V < VID < –0.01 V

VID ≤ –0.2 V

OPEN

Open circuit

Short Circuit

Idle (terminated) bus

over recommended operating conditions (unless otherwise noted)

PARAMETER(1)

TEST CONDITIONS

MIN

TYP

MAX

UNIT

L(I01)

Minimum air gap (Clearance)

Shortest terminal to terminal distance through air

8.34

Shortest terminal to terminal distance across the

L(I02)

Minimum external tracking (Creepage)

8.1

package surface

Tracking resistance (Comparative Tracking

CTI

DIN IEC 60112 / VDE 0303 Part 1

≥175

Index)

Minimum Internal Gap (Internal Clearance)

Distance through the insulation

0.008

Input to output, VIO = 500 V, all pins on each

RIO

Isolation resistance

side of the barrier tied together creating a

>1012

Ω

two-terminal device

CIO

Barrier capacitance Input to output

VI = 0.4 sin (4E6πt)

Input capacitance to ground

VI = 0.4 sin (4E6πt)

(1)

Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care

should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on

the printed circuit board do not reduce this distance.

Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation

Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.

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