TDA7580_07 datasheet(37/39 Pages) STMICROELECTRONICS

37 / 39 page

TDA7580

Package information

37/39

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 22.

Mechanical, data and package dimensions

OUTLINE AND

MECHANICAL DATA

TQFP64

Seating Plane

0.08mm

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.60

0.063

0.05

0.15

0.002

0.006

1.35

1.40

1.45

0.053

0.055

0.057

0.17

0.22

0.27

0.20

0.0066 0.0086 0.0106

0.0079

0.09

0.0035

11.80

12.00

12.20

0.464

0.472

0.480

9.80

10.00

10.20

0.386

0.394

0.401

7.50

0.295

0.50

0.0197

11.80

12.00

12.20

0.464

0.472

0.480

9.80

10.00

10.20

0.386

0.394

0.401

7.50

0.295

0.45

0.60

0.75

0.0177 0.0236 0.0295

1.00

0.0393

0˚ (min.), 3.5˚ (min.), 7˚(max.)

ccc

0.080

0.0031

LQFP64 (10 x 10 x 1.4mm)

0051434 F

ccc

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